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| plerowTM ALN0140WT Internally Matched LNA Module Features * S21 = 25.2 dB @ 125 MHz = 24.8 dB @ 155 MHz * NF of 0.7 dB over Frequency * Unconditionally Stable * Single 5V Supply * High OIP3 @ Low Current Description The plerowTM ALN-series is the compactly designed surface-mount module for the use of the LNA with or without the following gain blocks in the infrastructure equipment of the mobile wireless (CDMA, GSM, PCS, PHS, WCDMA, DMB, WLAN, WiBro, WiMAX), GPS, satellite communication terminals, CATV and so on. It has an exceptional performance of low noise figure, high gain, high OIP3, and low bias current. The stability factor is always kept more than unity over the application band in order to ensure its unconditionally stable implementation to the application system environment. The surface-mount module package including the completed matching circuit and other components necessary just in case allows very simple and convenient implementation onto the system board in mass production level. Specifications (in Production) Typ. @ T = 25C, Vs = 5 V, Freq. =140 MHz, Zo.sys = 50 ohm Parameter Frequency Range Gain Gain Flatness Noise Figure Output IP3 S11 / S22 (1) (2) Unit MHz dB dB dB dBm dB dBm Specifications Min 125 24 25 0.2 0.7 30 20 31 -12 / -18 21 73 5 50 C.W 23 ~ 25 (before fail) Surface Mount Type, 10Wx10Lx3.8H 90 0.3 0.75 Typ Max 155 1-stage Single Type More Information Website: www.asb.co.kr E-mail: sales@asb.co.kr Tel: (82) 42-528-7223 Fax: (82) 42-528-7222 ASB Inc., 4th Fl. Venture Town Bldg., 367-17 Goijeong-Dong, Seo-Gu, Daejon 302-716, Korea Output P1dB Switching Time Supply Current Supply Voltage Impedance Max. RF Input Power Package Type & Size (3) sec mA V dBm mm Operating temperature is -40C to +85C. 1) OIP3 is measured with two tones at an output power of +4 dBm / tone separated by 1 MHz. 2) S11/S22 (max) is the worst value within the frequency band. 3) Switching time means the time that takes for output power to get stabilized to its final level after switching DC voltage from 0 V to VS. Outline Drawing (Unit: mm) Pin Number Function RF In RF Out Vs Ground plerow ALN0140WT ASB Inc. (Top View) (Bottom View) 2 5 6 Others Solder Stencil Area Note: 1. The number and size of ground via holes in a circuit board is critical for thermal RF grounding considerations. 2. We recommend that the ground via holes be placed on the bottom of all ground pins for better RF and thermal performance, as shown in the drawing at the left side. (Side View) O0.4 plated thru holes to ground plane (Recommended Footprint) 1/4 www.asb.co.kr March 2009 plerowTM ALN0140WT Internally Matched LNA Module S-parameters Typical Performance (Measured) 125~155 +5 V S-parameters & K Factor Noise Figure OIP3 P1dB 2/4 www.asb.co.kr March 2009 plerowTM ALN0140WT Internally Matched LNA Module RF Performance with Voltage Change 1. S-parameter 125 MHz S21 (dB) S11 (dB) S22 (dB) S21 (dB) 140 MHz G/F (dB) S11 (dB) S22 (dB) S21 (dB) 155 MHz S11 (dB) S22 (dB) 4.50 V 4.75 V 5.00 V 5.25 V 5.50 V 24.99 25.25 25.46 25.62 25.72 -13.31 -14.22 -14.92 -15.43 -15.81 -24.17 -23.59 -22.92 -22.53 -22.90 24.83 25.09 25.30 25.44 25.55 0.35 0.36 0.37 0.39 0.40 -13.70 -14.60 -15.30 -15.80 -16.19 -25.05 -23.97 -22.90 -22.49 -22.77 24.64 24.89 25.09 25.23 25.32 -13.89 -14.77 -15.47 -15.98 -16.35 -25.74 -23.89 -22.64 -22.53 -22.74 2. OIP3, P1dB & NF 125 MHz OIP3 (dBm) P1dB (dBm) NF (dB) OIP3 (dBm) 140 MHz P1dB (dBm) NF (dB) OIP3 (dBm) 155 MHz P1dB (dBm) NF (dB) 4.50 V 4.75 V 5.00 V 5.25 V 5.50 V 30.80 31.22 31.16 30.89 30.86 20.20 21.06 21.80 22.37 22.83 0.558 0.604 0.632 0.643 0.701 30.74 31.28 31.31 31.11 31.06 20.00 21.02 21.83 22.39 22.86 0.506 0.538 0.555 0.573 0.606 30.76 31.50 31.61 31.57 31.60 20.16 21.19 21.81 22.39 22.84 0.439 0.444 0.492 0.536 0.552 Note: tested at room temperature. RF Performance with Operating Temperature 1. S-parameter 125 MHz S21 (dB) S11 (dB) S22 (dB) S21 (dB) 140 MHz G/F (dB) S11 (dB) S22 (dB) S21 (dB) 155 MHz S11 (dB) S22 (dB) -45 C -10 C 25 C 60 C 85 C 25.78 25.78 25.75 25.64 25.56 -16.67 -15.70 -14.90 -13.88 -13.35 -19.62 -20.92 -22.31 -23.21 -23.38 25.62 25.62 25.60 25.49 25.40 0.34 0.35 0.34 0.34 0.34 -17.38 -16.41 -15.46 -14.32 -13.76 -18.70 -20.07 -21.71 -23.16 -24.31 25.44 25.43 25.41 25.30 25.22 -17.64 -16.62 -15.64 -14.53 -13.92 -18.47 -20.01 -21.52 -24.17 -25.13 2. OIP3, P1dB & NF 125 MHz OIP3 (dBm) P1dB (dBm) NF (dB) OIP3 (dBm) 140 MHz P1dB (dBm) NF (dB) OIP3 (dBm) 155 MHz P1dB (dBm) NF (dB) -45 C -10 C 25 C 60 C 85 C 30.00 30.90 31.37 31.26 31.93 22.09 22.54 22.78 22.33 22.00 0.508 0.625 0.680 0.823 0.900 30.18 30.88 31.33 31.34 31.91 22.20 22.53 22.76 22.39 22.05 0.458 0.560 0.640 0.770 0.837 32.12 32.53 32.81 32.95 33.47 23.23 23.14 22.91 22.45 22.09 0.427 0.514 0.593 0.716 0.788 Note: tested at Vs= 5V. 3/4 www.asb.co.kr March 2009 plerowTM ALN0140WT Internally Matched LNA Module Application Circuit VS + - Tantal or MLC (Multi Layer Ceramic) Capacitor C1 IN C2 ALN OUT 1) The tantal or MLC (Multi Layer Ceramic) capacitor is optional and for bypassing the AC noise introduced from the DC supply. The capacitance value may be determined by customer's DC supply status. The capacitor should be placed as close as possible to Vs pin and be connected directly to the ground plane for the best electrical performance. DC blocking capacitors are always necessarily placed at the input and output port for allowing only the RF signal to pass and blocking the DC component in the signal. The DC blocking capacitors are included inside the ALN module. Therefore, C1 & C2 capacitors may not be necessary, but can be added just in case that the customer wants. The value of C1 & C2 is determined by considering the application frequency. 2) Recommended Soldering Reflow Process Evaluation Board Layout Vs 260C Ramp-up (3C/sec) 200C 20~40 sec Ramp-down (6C/sec) IN OUT 150C 60~180 sec Size 25x25mm (for ALN-AT, BT, T Series - 10x10mm) 4/4 www.asb.co.kr March 2009 |
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